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1. ChipQuik #ad
Chipquik Tack Flux no clean in a 10cc syringe w/plunger & tip, SMD291 #adChipQuik #ad
- Low melting temperature. Safe, affordable, easy and won't damage sensitive components. Special removal alloy has excellent wetting ability. Remove qfds, plccs, soics and chip components without costly equipment. Use with existing rework equipment or temp controlled soldering irons.
2. ChipQuik #ad
3Ag, 0.5Cu, 10cc, SN96.5, Chipquik SMD291SNL10 Solder Paste Rework Syringe #adChipQuik #ad
- The paste is 96. 5 percent tin, 3 percent silver, and 05 percent copper. Country of Origin : United States. Package weight : 011 pounds. Part number: smd291SNL10 .
3. 247 Solder #ad
No Clean SnPb Leaded Solder Paste 15 Grams #ad247 Solder #ad
- T4 new industry standard. Two dispensing tips 16g and 20g. 183c 361f melting Point Eutectic. 63sn37pb. Leaded Solder Paste.
4. Walfront #ad
100g Flux Paste NC‑559‑ASM 28um Solder Flux Paste Tin Cream No‑Clean Rework Solder Paste for Phone Repair Soldering #adWalfront #ad
- Prevent oxidation-- the high temperature of soldering is easy to oxidize the surface of the soldering material, and the solder paste helps prevent the oxidation process.
Low smoke emission-- high tin running speed, low smoke emission, and high residual insulation resistance on the surface after curing. High soldering quality-- the surface tension of the substance will affect the quality of soldering, another function of the solder paste is to reduce the tension of the material.
Suitable application-- used in mobile phone pcb, bga and PGA SMD rework solder paste and low ion system. Easy to carry & store-- small size, easy to carry and store, convenient to use and with good performance.
5. DIYPHONE #ad
BGA Activated Rosin Solder Paste Tin Rosin-Based Flux Paste Cream for Soldering Rework Station Circuit Board PCB BGA SMD Soldering Repair 80g #adDIYPHONE #ad
- High bond strength, welding surface smooth, insulation is strong, PH value neutral, is no corrosive for IC and PCB. Mechanic advanced paste flux soldering for mobile phone motherboard Repair, electric Soldering Iron Welding Fluxes for phone circuit board repair.
Specifications: model: mechanic-uv80; color: yellow, weight: 008kg; viscosity: 02pas; granularity: 022um; packing: Aluminum box.
Wipe the surface of the object before soldering, apply the paste flux to the solder joint, solder the tin to the solder joint with soldering iron. Its boiling point only slightly higher than the melting point of the solder, For mobile phones, PC cards and other sophisticated electronic chip-level help welding.
|Model||80G Rosin Flux Paste|
6. Estink #ad
Flux Paste, BGA and PGA SMD Rework, Solder Paste Soldering Solder Tin Cream 559 NC‑559‑ASM 28um No‑Clean for Phone PCB #adEstink #ad
- High tin running speed high tin running speed, low smoke emission, and high residual insulation resistance on the surface after curing. Function the surface tension of the substance will affect the quality of soldering, another function of the solder paste is to reduce the tension of the material.
Advantage the high temperature of soldering is easy to oxidize the surface of the soldering material, and the solder paste helps prevent the oxidation process.
High tin running speed high tin running speed, low smoke emission, and high residual insulation resistance on the surface after curing. Application used in mobile phone PCB, BGA and PGA SMD rework solder paste and low ion system. Easy to carry small size, easy to carry and store, convenient to use and with good performance.
7. TXINLEI #ad
TXINLEI 8858 110V Hot Air Solder Blower SMT Rework Station Optional Portable Heat Gun 480W #adTXINLEI #ad
- Adjust the air flow and temperature control pad. Comfortable portable handheld and the Digital LED display. The system has automatic cold air function, can extend the life of the heater and protect the hot air gun.
Safe solder qfp, plcc, BGA and other temperature-sensitive components. Microcomputer control and warming-up very quickly.
|Part Number||TXINLEI 8858|
8. YHJIC #ad
YHJIC BGA Reballing Directly Heat Stencils Solder Paste Tin Balls Station Steel Mesh BGA Reball Kit for Rework Repair #adYHJIC #ad
- A log planting platform can be used in combination with different log planting steel meshes, and BGA bales of different sizes can be planted. This set including the planting platform, scraper, hex wrench, steel mesh, tin balls, brush, etc.
Metal plating structure, light weight, durable, precision bearing capacity. High precision BGA universal stencils can be heated directly.
9. Delta Solder #ad
Delta Solder PF608-I No-Clean Paste Flux for Solder Assembly, Light Amber #adDelta Solder #ad
- Rohs compliant. Non-corrosive & non-conductive. Halide-free no-clean paste flux. Compatible with leaded & lead free chemistry.
10. Kester Solder #ad
Kester Solder RF741 No-Clean Tacky Rework Flux 30cc 57-0000-5025 #adKester Solder #ad
- Lead free - RoHS compliant. May be used with leaded or lead-free solders. Leaves bright/shiny solder joints after reflow. Residues are non-corrosive, no need to be removed after soldering. High viscosity- stays where you put it.